Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact

Microelectronics Reliability

Volumn 49, Issue 5, 2009, Pages 530-536

  Zhang, Bo ^a   Ding, Han ^a   Sheng, Xinjun ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE CRACKS; BULK SOLDERS; CYCLE TIME; DROP IMPACTS; DURATION TIME; DWELL TIME; FAILURE LOCATIONS; FAILURE MECHANISMS; FATIGUE CRACKS; IMC LAYERS; IMPACT PULSE; INTERMETALLIC COMPOUNDS; LEAD-FREE; LEAD-FREE SOLDERS; PEAK ACCELERATIONS; REACTION LAYERS; SOAK TIME; SOLDER INTERCONNECTIONS; SOLDER INTERFACES;

BRAZING; CRACKS; DROPS; NATURAL FREQUENCIES; PRINTED CIRCUITS; SEMICONDUCTING INTERMETALLICS; SOLDERED JOINTS; SOLDERING ALLOYS; TESTING; THERMAL CYCLING; TIN; WELDING;

LEAD;

EID: 67349228728     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.02.024     Document Type: Article

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