Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders

Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 181-188

  Huang, M L ^a,c   Loeher, T ^b   Manessis, D ^b   Boettcher, L ^c   Ostmann, A ^c   Reichl, H ^b,c  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^c FRAUNHOFER IZM   (Germany)

Author keywords

Aging; Electroless Ni P; Growth kinetics; Intermetallic compound (IMC); Lead free solder

Indexed keywords

AGING; ELECTROLESS NI-P; INTERMETALLIC COMPOUND (IMC); LEAD-FREE SOLDER;

GROWTH KINETICS; INTERFACES (MATERIALS); LEAD; NICKEL; PHOSPHORUS; SOLDERING ALLOYS;

INTERMETALLICS;

EID: 32644448202     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0202-1     Document Type: Conference Paper

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