Effect of SAC alloy composition on drop and temp cycle reliability of BGA with NiAu pad finish

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 1074-1079

  Kittidacha, Witoon ^a   Kanjanavika, Adirorn ^a   Vattananiyom, Karntida ^a  

^a Spansion ^*  (Thailand)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; ALLOYS; BRAZING; CHEMICAL ANALYSIS; DROPS; ELECTRIC CURRENTS; ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SILVER; SPHERES; WELDING;

ADDITIVE ELEMENTS; ALLOY COMPOSITIONS; ASSEMBLY PROBLEMS; BALL GRID ARRAY PACKAGES; CIRCUIT BOARDS; DROP TESTS; DROP-TEST PERFORMANCE; DWELL TIME; FAILURE DATUM; FAILURE DISTRIBUTIONS; PERFORMANCE IMPROVEMENTS; SAC-SOLDERS; SIGNIFICANT IMPACTS; SOLDER ALLOYS; SOLDER BALLS; TEMPERATURE CYCLING; TEST SAMPLES; WEIBULL STATISTICS;

COPPER ALLOYS;

EID: 63049090466     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763572     Document Type: Conference Paper

References (10)

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