A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints

Microelectronics International

Volumn 29, Issue 1, 2012, Pages 47-57

  Shnawah, Dhafer Abdul Ameer ^a   Sabri, Mohd Faizul Bin Mohd ^a   Badruddin, Irfan Anjum ^a   Said, Suhana ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

Ag content; Alloys; Drop impact; Mechanical properties of materials; Microstructure properties; Minor alloying elements; Sn Ag Cu solders; Solders; Thermal cycling

Indexed keywords

AG-CONTENT; DROP IMPACT; MECHANICAL PROPERTIES OF MATERIALS; MICROSTRUCTURE PROPERTIES; MINOR ALLOYING; SNAGCU SOLDER;

ALLOYING; ALLOYING ELEMENTS; ALLOYS; DROPS; MANGANESE; MECHANICAL PROPERTIES; RELIABILITY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; THERMAL CYCLING; TIN ALLOYS;

TIN;

EID: 84858055485     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565361211219202     Document Type: Article

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