Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high-strain rate conditions

Materials Science and Engineering: A

Volumn 460-461, Issue , 2007, Pages 595-603

  Suh, Daewoong ^a   Kim, Dong W ^a   Liu, Pilin ^a   Kim, Hyunchul ^a   Weninger, Jessica A ^a   Kumar, Chetan M ^a   Prasad, Aparna ^a   Grimsley, Brian W ^a   Tejada, Hazel B ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Drop testing; Extrinsic toughening; Fracture; Lead free solder; Sn Ag Cu

Indexed keywords

CHEMISTRY; COMPOSITION EFFECTS; FRACTURE TOUGHNESS; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); INTERMETALLICS; SILVER; STRAIN RATE; TIN ALLOYS; TOUGHENING;

DROP TESTING; EXTRINSIC TOUGHENING; LEAD-FREE SOLDER; PLASTIC ENERGY DISSIPATION;

SOLDERING ALLOYS;

CHEMISTRY; COMPOSITION EFFECTS; FRACTURE TOUGHNESS; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); INTERMETALLICS; SILVER; SOLDERING ALLOYS; STRAIN RATE; TIN ALLOYS; TOUGHENING;

EID: 34247145459     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.01.145     Document Type: Article

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