Drop impact analysis of Sn-Ag-Cu solder joints using dynamic high-strain rate plastic strain as the impact damage driving force

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 49-54

  Pang, John H L ^a   Che, F X ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; FAILURE (MECHANICAL); MATHEMATICAL MODELS; PLASTIC DEFORMATION; SILVER; STRAIN; TIN;

DROP IMPACT ANALYSIS; DYNAMIC CHARACTERIZATION; PLASTIC STRAIN;

SOLDERED JOINTS;

EID: 33845588217     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645625     Document Type: Conference Paper

References (10)

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