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Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 1-3, 2007, Pages 39-54

The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

(1) Swenson, D a

a Michigan Technological University (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; METALLOGRAPHIC MICROSTRUCTURE; NUCLEATION; PHASE DIAGRAMS; SOLDERING ALLOYS; SOLIDIFICATION; TIN ALLOYS; VOLUME FRACTION;

LEAD-FREE SOLDER JOINTS; SOLID PHASE GROWTH;

SOLDERED JOINTS;

EID: 33845698380 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-006-9012-8 Document Type: Review

Times cited : (73)

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