Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties

JOM

Volumn 61, Issue 6, 2009, Pages 29-38

  Dutta, I ^a   Kumar, P ^a   Subbarayan, G ^b  

^a Washington State University   (United States)

^b PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCURATE PREDICTION; CONSTITUTIVE LAW; FRACTURE PROPERTY; JOINT PROPERTY; MICROSTRUCTURAL COARSENING; SCALE DEPENDENCE; SN-AG ALLOYS; SPATIAL VARIATIONS; THERMOMECHANICAL CYCLING;

COARSENING; SILVER; SILVER ALLOYS; TIN;

MECHANICAL PROPERTIES;

EID: 70349751731     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-009-0085-8     Document Type: Article

References (52)

1. S.K. Kang et al., IBM J Res. Dev., 49 (2005), pp. 607-620.
2. S. Choi et al., J. Electron. Mater., 28 (1999), pp. 1209-1215.
3. K.N. Subramanian, T.R. Bieler, and J.P. Lucas, J. Electron. Mater., 28 (1999), pp. 1176-1183.
4. P.T. Vianco, J.A. Rejent, and A.C. Kilgo, J. Electron. Mater., 33 (2004), pp. 1473-1484.
5. Y. Ding et al., J. Alloys and Compounds, 428 (2007), pp. 274-285.
6. F. Guo et al., Solder. Surf. Mount Tech., 12 (2001), pp. 7-18.
7. A. Zribi et al., JOM, 54 (6) (2002), pp. 38-40.
8. Q. Xiao, L. Nguyen, and W.D. Armstrong, Proc. of the 2004 Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2004), pp. 1325-1332.
9. R. Fix et al., J. Electron. Mater., 34 (2005), pp. 137-142.
10. I. Dutta, J. Electron. Mater., 32 (2003), pp. 201-207.
11. I. Dutta et al., Mater. Sci. Eng. A, 410-411 (2005), pp. 48-52.
12. R. Fix, W. Nuchter, and Jurgen Wilde, Soldering and Mount Technology, 20 (2008), pp. 13-21.
13. S. Wiese, E. Meusel and K.-L. Wolter, Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2003), pp. 197-206.
14. S.L. Allen et al., J. Mater. Res., 19 (2004), pp. 1417-1424.
15. H.L.J. Pang et al., Mater. Sci. Eng. A, 307 (2001), pp. 42-50.
16. T.Y. Lee et al., J. Mater. Sci., 17 (2002), pp. 291-301.
17. Y.C. Chana et al., Mater. Sci. Eng. B, 55 (1998), pp. 5-13.
18. A. Zribi et al., J. Electron. Mater., 30 (2001), pp. 1157-1164.
19. D. Suh et al., Mater. Sci. Eng. A, 460-461 (2007), pp. 595-603.
20. E. Ho et al., J. Electron. Mater., 31 (2002), pp. 584-590.
21. P. Kumar et al., Proc. 10th Electronics Packaging Technology Conference (EPTC) (Piscataway, NJ: IEEE, 2008), pp. 903-909.
22. R. Marks et al., Proc. ITherm 2004 (IEEE CDROM) (Piscataway, NJ: IEEE, 2004), p. 95.
23. I. Dutta, C. Park, and S. Choi, Mater. Sci. Eng. A, A379 (2004), p. 401.
24. R.S. Sidhu, X. Deng, and N. Chawla, Metall. Mater. Trans. A, 39 (2008), pp. 349-362.
25. X. Deng et al., Metall. Mater. Trans. A, 36 (2005), pp. 55-64.
26. K. Mysore et al., Proc. 11th Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (Piscataway, NJ: IEEE, 2008), pp. 870-875.
27. X. Long et al., J. Electron. Mater., 37 (2008), pp. 189-200.
28. P. Kumar et al., in Ref. 26, pp. 660-667.
29. P. Lall et al., in Ref. 26, pp. 822-835.
30. D.S. Liu et al., Mater. Sci. Eng. A, 494 (2008), pp. 196-202.
31. D. Pan et al., Review of Scientific Instruments, 75 (2004), pp. 5244-5252.
32. E.A. Brandes and G.B. Brook, editors, Smithells Metals Reference Book, 7th edition (Oxford, U.K.: Butterworth-Heinemann, 1992), p. 13.
33. L. Smugovsky, D.D. Perovic, and J.W. Rutter, Powder Metallurgy, 48 (2005), pp. 193-198.
34. H. Nishikawa, J.Y. Piao, and T. Takemoto, J. Japan Inst. Metals, 70 (2006), pp. 427-433.
35. W. Henderson et al., J. Mater. Res., 17 (2002), pp. 2775-2778.
36. H.Y. Lu, H. Balkan, and K.Y.S. Ng, J. Mater. Sci.-Materials in Electronics, 17 (2006), pp. 171-188.
37. H.G. Song, J.W. Morris, and F. Hua, Materials Transactions, 43 (2002), p. 184.
38. M.D. Mathew et al., Metall. Mater. Trans. A, 36 (2005), pp. 99-105.
39. M.A. Rist, W.J. Plumbridge, and S. Cooper, J. Electron. Mater., 35 (2006) p. 1050.
40. S.W. Shin and J. Yu, J. Electron. Mater., 34 (2005), p. 188.
41. Z. Guo, Y.H. Pao, and H. Conrad, Trans. ASME, J. Electron. Packaging, 117 (1995), p. 100.
42. R.W. Neu, D.T. Scott, and M.W. Woodmansee, ASME Trans., J. Electron. Packaging, 123 (2001), p. 238.
43. M. Kerr and N. Chawla, Acta Materialia, 52 (2004), p. 4527.
44. C. Park et al., J. Mater. Sci., 42 (2007), pp. 5182-5187.
45. L.M. Brown and R.K. Ham, Strengthening Methods in Crystals, ed. A. Kelly and R.B. Nicholson (London: Appl. Sci. Publ. Ltd., 1971), pp. 12-135.
46. R. Lagenborg, Scripta Metall., 7 (1973), p. 605.
47. E. Arzt and J. Rosler, Acta Metall., 36 (1988), p. 1053.
48. J. Rosler and E. Arzt, Acta Metall. Mater., 38 (1990), p. 671.
49. M.L. Huang, L. Wang, and C.M.L. Wu, J. Mater. Research, 17 (2002), p. 2897.
50. P. Adeva et al., Mater. Sci. Eng. A, A194 (1995), pp. 17-23.
51. T. Reinikainen and J. Kivilahti, Metall. Mater. Trans., 30A (1999), pp. 123-132.
52. G.S. Ansell and J. Weertman, Trans. TMS-AIME, 215 (1959), p. 838.