Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

Journal of Electronic Materials

Volumn 27, Issue 7, 1998, Pages 866-870

  Kariya, Yoshiharu ^a   Otsuka, Masahisa ^a  

^a SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Coffin Manson's law; Fatigue life; Isothermal fatigue; Lead free solder; Mechanical properties; Sn Ag; Sn Ag Bi

Indexed keywords

EID: 0000278386     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0111-6     Document Type: Article

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