SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2617-2627

Correlations between the microstructure and fatigue life of near-eutectic Sn-Ag-Cu Pb-free solders

(2) Arfaei, Babak a Cotts, Eric a

a BINGHAMTON UNIVERSITY (United States)

Author keywords

Grain orientation; Microstructure; Precipitates; Sn Ag Cu (SAC) solder

Indexed keywords

AVERAGE SIZE; FATIGUE LIFE; FATIGUE LIFETIME; GRAIN ORIENTATION; LENGTH SCALE; PB FREE SOLDERS; ROOM TEMPERATURE; SINGLE SAMPLE; SN DENDRITES; SN GRAINS; SN-AG-CU; SOLDER JOINTS;

DENDRITES (METALLOGRAPHY); EUTECTICS; FATIGUE OF MATERIALS; LEAD; MICROSTRUCTURE; PRECIPITATES; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 72549110835 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0932-y Document Type: Article

Times cited : (33)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.