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Volumn , Issue , 2007, Pages 669-676

Drop shock reliability of lead-free alloys - Effect of micro-additives

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; DUCTILITY; INTERFACES (MATERIALS); INTERMETALLICS; TIN ALLOYS;

EID: 35348814909     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373868     Document Type: Conference Paper
Times cited : (111)

References (16)
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    • Gao, F.1    Takemoto, T.2    Nishikawa, H.3
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    • 35348835166 scopus 로고    scopus 로고
    • Patent Applied, Feb 2007
    • Patent Applied, Feb 2007
  • 8
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    • JEDEC Solid State Technology Association, JESD22-B111: Board Level Drop Test Method of Component for Handheld Electronics Products, 2003
    • JEDEC Solid State Technology Association, JESD22-B111: "Board Level Drop Test Method of Component for Handheld Electronics Products", 2003
  • 9
    • 24644432659 scopus 로고    scopus 로고
    • BGA Brittle Fracture - Alternative Solder Joint Integrity Test Methods
    • Orlando, FL, May-June
    • K. Newman, "BGA Brittle Fracture - Alternative Solder Joint Integrity Test Methods," Proc. 55th Electronic Components and Technology Conf., Orlando, FL, May-June 2005, pp. 1194-1201.
    • (2005) Proc. 55th Electronic Components and Technology Conf , pp. 1194-1201
    • Newman, K.1
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    • Identification of Brittle Solder Joints using High Strain Rate Testing of BGA Solder Joints to be
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    • R. Pandher and M. Boureghda, "Identification of Brittle Solder Joints using High Strain Rate Testing of BGA Solder Joints" to be Presented at International Reliability Symposium, Phoenix, April 15-19, 2007.
    • (2007) International Reliability Symposium
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  • 11
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    • Effects of Cu, Bi and In on Microstructure and Tensile Properties of SnAg-X (Cu, Bi, In) Solders
    • M. L. Huang and L. Wang, Effects of Cu, Bi and In on Microstructure and Tensile Properties of SnAg-X (Cu, Bi, In) Solders, Met. And Mat. Trans., 36A, 6, p1439, 2005
    • (2005) Met. And Mat. Trans , vol.36 A , Issue.6 , pp. 1439
    • Huang, M.L.1    Wang, L.2
  • 12
    • 0035901438 scopus 로고    scopus 로고
    • Interfacial Segregation of Bismuth in Cu/Sn-Bi Solder Interconnect
    • P.L. Liu and J. K. Shang, Interfacial Segregation of Bismuth in Cu/Sn-Bi Solder Interconnect, Scripta Met. 44, p1019, 2001
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    • A Study of the Reaction between Cu and SnAg doped with small amounts of Ni
    • J. Y. Tsai, Y. C. Hu, C. M. Tsai and C. R. Kao, A Study of the Reaction between Cu and SnAg doped with small amounts of Ni, J. Elect. Mat. 32, No 11, p 1203, 2003
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.