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Volumn 39, Issue 3, 2010, Pages 273-282

Microstructure and in situ observations of undercooling for nucleation of β-Sn relevant to lead-free solder alloys

(3) Elmer, John W a Specht, Eliot D b Kumar, Mukul a

a LAWRENCE LIVERMORE NATIONAL LABORATORY (United States)

b OAK RIDGE NATIONAL LABORATORY (United States)

Author keywords

Cooling rate; Grain boundaries; In situ x ray diffraction; Lead free solders; Microstructure; Nucleation; Solidification; Tin; Twinning; Undercooling; Wetting

Indexed keywords

ANISOTROPIC BEHAVIORS; COOLING RATE; COOLING RATES; ELECTRON BACKSCATTERING DIFFRACTION; EUTECTIC MICROSTRUCTURE; HIGH PURITY; IN-SITU; IN-SITU OBSERVATIONS; INTERMETALLIC PHASE; LARGE-GRAIN; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; NON-WETTING; PURE SN; SOLDER JOINTS; SOLIDIFICATION OF TIN; UNDERCOOLINGS;

BACKSCATTERING; CERIUM ALLOYS; COOLING; COPPER; CRYSTALLIZATION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; GRAPHITE; LEAD; MECHANICAL PROPERTIES; MICROSTRUCTURE; NUCLEATION; OPTICAL MICROSCOPY; PHASE INTERFACES; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TIN ALLOYS; TITANIUM COMPOUNDS; TWINNING; UNDERCOOLING; WETTING; X RAY DIFFRACTION;

TIN;

EID: 77951025514 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1080-0 Document Type: Article

Times cited : (38)

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