A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni

Journal of Electronic Materials

Volumn 32, Issue 11, 2003, Pages 1203-1208

  Tsai, J Y ^a   Hu, Y C ^a   Tsai, C M ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Interfacial reaction; Lead free solder; Sn Ag; Surface finish

Indexed keywords

AGING OF MATERIALS; COPPER; COPPER ALLOYS; CRYSTAL GROWTH; FINISHING; INTERFACES (MATERIALS); INTERMETALLICS; ISOTHERMS; LEAD; NICKEL; REACTION KINETICS; SOLDERING;

INTERFACIAL REACTION; LEAD FREE SOLDER;

TIN ALLOYS;

EID: 0348107255     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0012-7     Document Type: Article

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