Effect of alloying elements on properties and microstructures of SnAgCu solders

Microelectronic Engineering

Volumn 87, Issue 11, 2010, Pages 2025-2034

  Gao, Lili ^a   Xue, Songbai ^a   Zhang, Liang ^a   Sheng, Zhong ^a   Ji, Feng ^a   Dai, Wei ^a   Yu, Sheng Lin ^a,b   Zeng, Guang ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

Alloying elements; Creep behavior; Mechanical properties; SnAgCu solders; Wettability

Indexed keywords

ALLOYING; ALLOYING ELEMENTS; BINARY ALLOYS; BISMUTH ALLOYS; COBALT ALLOYS; COPPER COMPOUNDS; CREEP; GALLIUM ALLOYS; LEAD-FREE SOLDERS; MECHANICAL PROPERTIES; MICROSTRUCTURE; NANOPARTICLES; NICKEL SILVER; RARE EARTHS; SILVER ALLOYS; TERNARY ALLOYS; TIN ALLOYS; TIN COMPOUNDS; WETTING;

CREEP BEHAVIORS; CU-SN COMPOUNDS; ELECTRONIC INDUSTRIES; LEAD-FREE SOLDER ALLOY; MICROSTRUCTURE REFINEMENT; PROPERTIES AND MICROSTRUCTURES; SHEAR STRENGTH OF JOINT; SNAGCU SOLDER;

LEAD ALLOYS;

EID: 77955510771     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2010.04.007     Document Type: Review

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