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Journal of Electronic Materials
Volumn 39, Issue 12, 2010, Pages 2588-2597
Sn-Ag-Cu Solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy
Author keywords

microstructure; orientation image microscopy (OIM); Pb free solder; Sn grain orientation; thermal fatigue
Indexed keywords

C-AXIS ORIENTATIONS; DISTRIBUTION MAPS; ISOTHERMAL AGING; MICROSTRUCTURE EVOLUTIONS; ORIENTATION IMAGE MICROSCOPY (OIM); ORIENTATION IMAGING MICROSCOPY; PB FREE SOLDERS; PLASTIC BALL GRID ARRAYS; POLARIZED OPTICAL MICROSCOPY; SN GRAINS; SNAGCU SOLDER; SOLDER JOINTS; THERMAL CYCLE;
EID: 78049529833     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1348-4     Document Type: Conference Paper
Times cited : (80)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.