Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

Journal of Electronic Materials

Volumn 35, Issue 3, 2006, Pages 479-485

  Kang, Sung K ^a   Leonard, Donovan ^a   Shih, D A Yuan ^a   Gignac, Lynne ^a   Henderson, D W ^b   Cho, Sungil ^c   Yu, Jin ^c  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Ag 3Sn plates; Interfacial reactions; Pb free solders; Reflow reaction; Sn Ag Cu alloys

Indexed keywords

COOLING RATE; INTERFACIAL REACTIONS; NEAR TERNARY EUTECTIC; TIN SOLIDIFICATION;

ALLOYING; EUTECTICS; GROWTH KINETICS; INTERMETALLICS; LEAD; MICROELECTRONICS; RELIABILITY; SOLIDIFICATION; TERNARY SYSTEMS;

SOLDERED JOINTS;

EID: 33645566980     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02690535     Document Type: Article

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