Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating

Journal of Electronic Materials

Volumn 33, Issue 10, 2004, Pages 1200-1209

  Hwang, Chi Won ^a   Suganuma, Katsuaki ^a   Kiso, Masayuki ^b   Hashimoto, Shigeo ^b  

^a OSAKA UNIVERSITY   (Japan)

^b Central Research and Development Laboratory   (Japan)

Author keywords

Interface; Joint strength; Lead free soldering; Ni 6P; Sn Ag Cu

Indexed keywords

COPPER COMPOUNDS; DEGRADATION; DIFFUSION; FRACTURE; INTERFACES (MATERIALS); INTERMETALLICS; LEAD; MATRIX ALGEBRA; MICROSTRUCTURE; NICKEL COMPOUNDS; SILVER COMPOUNDS; TIN COMPOUNDS;

JOINT STRENGTH; LEAD-FREE SOLDERING; NI-6P; SN-AG-CU;

SOLDERING;

EID: 7044228178     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0123-9     Document Type: Conference Paper

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