Morphology changes in solder joints - Experimental evidence and physical understanding

Microelectronics Reliability

Volumn 44, Issue 12, 2004, Pages 1901-1914

  Muller W H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; INTERFACES (MATERIALS); MICROELECTRONICS; PASSIVATION; STRAIN; STRESS ANALYSIS;

MECHANICAL STRESSES; MICROELECTRONIC COMPONENTS; MICROELECTRONIC INDUSTRY; SOLDER BULK;

SOLDERED JOINTS;

EID: 6444235760     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.04.020     Document Type: Conference Paper

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