SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 39, Issue 12, 2010, Pages 2522-2527

Interfacial reactions of Sn-3.0Ag-0.5Cu solder with Cu-Mn UBM during aging

(3) Tseng, Chien Fu a Wang, Kai Jheng a Duh, Jenq Gong a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Cu Mn UBM; interfacial reaction; Sn Ag Cu solder

Indexed keywords

CU METALLIZATION; CU UNDER BUMP METALLURGIES; CU-MN UBM; ELEMENTAL MAPPING; FLIP CHIP TECHNOLOGIES; INTERFACIAL REACTIONS; KINETIC ANALYSIS; KIRKENDALL VOID; MN CONCENTRATIONS; RAPID GROWTH; RICH PHASE; SN-3.0AG-0.5CU; SNAGCU SOLDER; SOLDER JOINTS;

DIFFUSION; INTERMETALLICS; MANGANESE; REACTION RATES; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL AGING; TIN ALLOYS;

TIN;

EID: 78049530863 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1371-5 Document Type: Conference Paper

Times cited : (19)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.