Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X = Bi and Cu) solder joints

Journal of Electronic Materials

Volumn 28, Issue 11, 1999, Pages 1263-1269

  Kariya, Yoshiharu ^a   Hirata, Yasunori ^a   Otsuka, Masahisa ^a  

^a SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; ELECTRONICS PACKAGING; FATIGUE TESTING; RELIABILITY; SOLDERING ALLOYS; THERMAL CYCLING; THERMAL EFFECTS; TIN ALLOYS;

QUAD FLAT PACKS (QFP); THERMAL FATIGUE;

SOLDERED JOINTS;

EID: 0033222086     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0166-z     Document Type: Article

References (15)

1. B. Trumble, IEEE Spectrum, 35, 55 (1998).
2. D.P. Napp, SAMPE Journal, 32, 59 (1996).
3. M. McCormack and S. Jin, J. Electron. Mater. 23, 715 (1994).
4. M.E. Loomans, S. Vaynman, G. Ghosh, and M.E. Fine, J. Electron. Mater. 23, 741 (1994).
5. C.M. Miller, I.E. Anderson, and J.F. Smith, J. Electron. Mater. 23, 595 (1994).
6. U.R. Kattner and W.J. Boettinger, J. Electron. Mater. 23, 603 (1994).
7. M. McCormack and S. Jin, J. Electron. Mater. 23, 635 (1994).
8. M. McCormack, S. Jin, and D.A. Machusak, J. Electron. Mater. 23, 687 (1994).
9. J.H. Lau, Solder Joint Reliability, 572, (New York: Van Nostrand Reinhold, 1991).
10. T. Takemoto, M. Takahasi, A. Matsunawa, R. Ninomiya, and H. Tai, J. Japan Welding Soc. 16, 87 (1998).
11. NCMS, Lead Free Solder Project, Final Report, NCMS Report 0401RE96 (Ann Arbor, MI: National Center for Manufacturing Sciences, August 1997).
12. H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M. Fine, J. Electron. Mater. 26, 783 (1997).
13. D.R. Frear, JOM 48, 49 (1996).
14. Y. Kariya and M. Otsuka, J. Electron. Mater. 27, 866 (1998).
15. Y. Kariya and M. Otsuka, J. Electron. Mater. 27, 1223 (1998).