Advances in the drop-impact reliability of solder joints for mobile applications

Microelectronics Reliability

Volumn 49, Issue 2, 2009, Pages 139-149

  Wong, E H ^a   Seah, S K W ^a   van Driel, W D ^b   Caers, J F J M ^c   Owens, N ^d   Lai, Y S ^e  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NXP SEMICONDUCTORS   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

^d FREESCALE SEMICONDUCTOR INC   (United States)

^e ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CRACKS; DROPS; ELECTRONIC EQUIPMENT MANUFACTURE; FAILURE ANALYSIS; METALLIC COMPOUNDS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SOLDERING ALLOYS; STRAIN; TESTING; WELDING;

ANALYTICAL SOLUTIONS; BEND TESTS; BENDING FREQUENCIES; CHARACTERISATION; COMPONENT LEVELS; CRACK PATHS; DESIGN RULES; DROP IMPACTS; ELECTRICAL RESISTANCE MEASUREMENTS; EVALUATION OF TESTS; FATIGUE CHARACTERISTICS; HIGH-SPEED; LOAD HISTORY; MEDIUM STRAIN RATES; MINER'S RULES; MOBILE APPLICATIONS; PCB ASSEMBLIES; PERFORMANCE RANKINGS; RESEARCH STUDIES; SHEAR TESTS; SOLDER ALLOYS; SOLDER JOINTS; STEP LOADS; STRESS STRAINS; STRESS-STRAIN CHARACTERISTICS; TEST METHODS; TEST TEMPERATURES;

STRAIN RATE;

EID: 59549101503     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.12.001     Document Type: Article

References (29)

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