Reliability of soldered joints in CSPs of various designs and mounting conditions

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 2, 2001, Pages 293-299

  Sumikawa, Masato ^a   Sato, Tomotoshi ^b   Yoshioka, Chiyoshi ^a   Nukii, Takashi ^a  

^a SHARP CORPORATION   (Japan)

^b JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

Author keywords

CSP; FEM analysis; Ni Au plated pad; Reliability; Thermal fatigue; Weibull cumulative hazard analysis

Indexed keywords

CHIP SCALE PACKAGES; CREEP; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MOUNTINGS; PRINTED CIRCUIT BOARDS; RELIABILITY; THERMAL CYCLING; VISCOPLASTICITY; WETTING;

THERMAL FATIGUE; WEIBULL CUMULATIVE HAZARD ANALYSIS;

SOLDERED JOINTS;

EID: 0035365016     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.926396     Document Type: Article

References (11)

1. Reliability of controlled collapse interconnections
2. Design considerations for a flip-chip joining technique
3. Thermal fatigue life of Pb-Sn alloy interconnections
4. Fatigue-strength of microelectronics solder joints under thermal cyclic loading
5. Thermal fatigue reliability assessment for solder joints of BGA assembly
6. Elastic-creep behavior and fatigue life in an IC package solder joint
7. Chip scale package (CSP) solder joint reliability and modeling
8. Reliability and fatigue life prediction of mounted CSP
9. Chip scale package implementation challenges