Improved drop reliability performance with lead free solders of low Ag content and their failure modes

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 962-967

  Kim, Hyunchul ^a   Zhang, Mu ^a   Kumar, Chetan M ^a   Suh, Daewoong ^a   Liu, Pilin ^a   Kim, Dongwook ^a   Xie, Mayue ^a   Wang, Zhiyong ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FAILURE ANALYSIS; FINITE ELEMENT METHOD; HAND HELD COMPUTERS; MICROELECTRONIC PROCESSING; MOBILE PHONES; SOLDERED JOINTS;

DROP RELIABILITY; DROP TEST STRESS CONDITIONS; DROP TESTING; HIGH STRESS CONCENTRATION DISTRIBUTION; LEAD FREE SOLDERS;

SOLDERING ALLOYS;

EID: 35348848383     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373913     Document Type: Conference Paper

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