Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder

Journal of Electronic Materials

Volumn 35, Issue 2, 2006, Pages 292-301

  Lin, Chih Kuang ^a   Huang, Chun Ming ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Lead free solder; Low cycle fatigue; Sn 3.5Ag 0.5Cu; Strain ratio; Tensile hold time

Indexed keywords

COPPER; FATIGUE OF MATERIALS; LEAD; STRAIN; TIN;

LEAD-FREE SOLDER; LOW-CYCLE FATIGUE; SN-3.5AG-0.5CU; STRAIN RATIO; TENSILE HOLD TIME;

SOLDERING ALLOYS;

EID: 33644898836     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692449     Document Type: Conference Paper

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