The effect of the addition of in on the reaction and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy

Metals and Materials International

Volumn 13, Issue 6, 2007, Pages 517-520

  Yu, A Mi ^a   Lee, Chang Woo ^a   Kim, Mok Soon ^b   Lee, Jong Hyun ^a  

^a Korea Institute of Industrial Technology   (South Korea)

^b Inha University   (South Korea)

Author keywords

Elongation; Pb free solder; Sn Ag Cu In alloy; Toughness; Wettability

Indexed keywords

ELONGATION; LEAD-FREE SOLDERS; MECHANICAL PROPERTIES; SILVER ALLOYS; SOLDERING; TERNARY ALLOYS; TIN ALLOYS; TOUGHNESS; WETTING;

QUATERNARY ALLOYS; REACTION BEHAVIOR; REFLOW TEMPERATURES; SN-3.0AG-0.5CU; SN-AG-CU; SOLDER ALLOYS;

COPPER ALLOYS;

EID: 38349185014     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03027912     Document Type: Article

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