Material issues in electronic interconnects and packaging

Journal of Electronic Materials

Volumn 30, Issue 4, 2001, Pages 372-378

  Subramanian, K N ^a   Lee, A ^a   Choi, S ^a   Sonje, P ^a  

^a Michigan State University   (United States)

Author keywords

CTE; Eutectic Sn Ag; Mismatches; Sn Ag Cu solder

Indexed keywords

CERAMIC MATERIALS; FATIGUE OF MATERIALS; METALLIC COMPOUNDS; METALLIZING; POLYMERS; RELIABILITY; SOLDERED JOINTS; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

ELECTRONIC INTERCONNECTS;

ELECTRONICS PACKAGING;

EID: 0035306684     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0046-7     Document Type: Article

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