Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character

Journal of Electronic Materials

Volumn 38, Issue 1, 2009, Pages 33-38

  Terashima, S ^a   Kohno, T ^a   Mizusawa, A ^b   Arai, K ^b   Okada, O ^b   Wakabayashi, T ^b   Tanaka, M ^a   Tatsumi, K ^a  

^a NIPPON STEEL CORPORATION   (Japan)

^b CASIO   (Japan)

Author keywords

Grain boundary character distribution; Lead free solder; Orientation imaging microscopy; Sn Ag Cu; Thermal fatigue

Indexed keywords

COINCIDENCE SITE LATTICE BOUNDARIES; FATIGUE PROPERTIES; GRAIN BOUNDARY CHARACTER DISTRIBUTION; LEAD-FREE SOLDER; ORIENTATION IMAGING MICROSCOPY; SILVER CONTENTS; SN-AG-CU;

BRAZING; COPPER; CRYSTAL GROWTH; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; LEAD; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL FATIGUE; TIN ALLOYS; TITANIUM COMPOUNDS; WELDING;

TIN;

EID: 57649171539     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0560-y     Document Type: Conference Paper

References (26)

1. C.M. Miller I.E. Anderson J.F. Smith 1994 J. Electron. Mater. 23 595
2. D.R. Frear 1996 JOM 48 49
3. H. Mavoori J. Chin S. Vaynman B. Moran L. Keer M. Fine 1997 J. Electron. Mater. 26 783 10.1007/s11664-997-0252-z
4. M. Tanaka, T. Sasaki, T. Kobayashi, and K. Tatsumi, Proceedings of 56th Electronic Components and Technology Conference (San Diego, USA: IEEE, 2006), p. 78.
5. S. Terashima Y. Kariya M. Tanaka 2004 Mater. Trans. 45 673 10.2320/matertrans.45.673
6. S. Terashima M. Tanaka 2004 Mater. Trans. 45 681 10.2320/matertrans.45. 681
7. S. Terashima K. Takahama M. Nozaki M. Tanaka 2004 Mater. Trans. 45 1383 10.2320/matertrans.45.1383
8. S. Terashima, T. Kobayashi, and M. Tanaka, Sci. Technol. Weld. Join. (in press). doi: 10.1179/136217108X336270
9. S. Terashima M. Tanaka K. Tatsumi 2008 Sci. Technol. Weld. Join. 13 60 10.1179/174329308X271788
10. T. Wakabayashi and O. Okada, Private communication.
11. S. Terashima Y. Kariya T. Hosoi M. Tanaka 2003 J. Electron. Mater. 32 1527 10.1007/s11664-003-0125-z
12. Y. Kariya T. Hosoi S. Terashima M. Tanaka M. Otsuka 2004 J. Electron. Mater. 33 321 10.1007/s11664-004-0138-2
13. D.W. Henderson, J.J. Woods, T.A. Gosselin, J. Bartelo, D.E. King, T.M. Korhonen, M.A. Korhonen, L.P. Lehman, E.J. Cotts, S.K. Kang, P. Lauro, D.-Y. Shih, C. Goldsmith, and K.J. Puttlitz, J. Mater. Res. 19, 1608 (2004). doi: 10.1557/JMR.2004.0222.
14. M.A. Matin E.W.C. Coenen W.P. Vellinga M.G.D. Geers 2005 Scripta Mater. 52 927 10.1016/j.scriptamat.2005.06.034
15. K.N. Subramanian J.G. Lee 2006 Mater. Sci. Eng. A 421 46 10.1016/j.msea.2005.10.005
16. T. Watanabe M. Yamada S. Karashima S. Shima 1979 Philos. Mag. A 40 667 10.1080/01418617908234867
17. T. Watanabe S. Kimura S. Karashima 1984 Philos. Mag. A 49 845 10.1080/01418618408236566
18. T. Watanabe 1993 Mater. Sci. Eng. A 166 11 10.1016/0921-5093(93)90306-Y
19. T. Watanabe 2005 Mater. Sci. Eng. A 410-411 140 10.1016/j.msea.2005.08. 083
20. J.K. Shang Q.L. Zeng L. Zhang Q.S. Zhu 2007 J. Mater. Sci. Mater. Electron. 18 211 10.1007/s10854-006-9027-1
21. A.U. Telang T.R. Bieler S. Choi K.N. Subramanian 2002 J. Mater. Res. 17 2294 10.1557/JMR.2002.0337
22. A.U. Telang T.R. Bieler 2005 Scripta Mater. 52 1027 10.1016/j.scriptamat. 2005.01.043
23. A.U. Telang T.R. Bieler 2005 JOM 57 44 10.1007/s11837-005-0135-9
24. Y. Kariya T. Hosoi T. Kimura S. Terashima M. Tanaka 2004 Mater. Trans. 45 689 10.2320/matertrans.45.689
25. A.U. Telang T.R. Bieler M.A. Crimp 2006 Sci. Eng. A 421 22 10.1016/j.msea.2005.10.009
26. S. Park R. Dhakal L. Lehman E. Cotts 2007 Acta Mater. 55 3253 10.1016/j.actamat.2007.01.028