Predicting the drop performance of solder joints by evaluating the elastic strain energy from high-speed ball pull tests

Journal of Electronic Materials

Volumn 38, Issue 3, 2009, Pages 410-414

  You, Taehoon ^a   Kim, Yunsung ^a   Kim, Jina ^a   Lee, Jaehong ^b   Jung, Byungwook ^b   Moon, Jungtak ^b   Choe, Heeman ^a  

^a Kookmin University   (South Korea)

^b MK Electron Co Ltd   (South Korea)

Author keywords

Deformation and fracture; Elastic properties; Intermetallic alloys and compounds; Mechanical properties; SnAgCu; Solder joint

Indexed keywords

DEFORMATION AND FRACTURE; ELASTIC PROPERTIES; INTERMETALLIC ALLOYS AND COMPOUNDS; SNAGCU; SOLDER JOINT;

BRAZING; CONCRETES; COPPER; COPPER ALLOYS; DEFORMATION; DIGITAL DEVICES; DROPS; ELASTICITY; FRACTURE; HAND HELD COMPUTERS; IMPACT RESISTANCE; INTERMETALLICS; LEAD; MECHANICAL PROPERTIES; METALLIC COMPOUNDS; PERSONAL DIGITAL ASSISTANTS; SILVER; SILVER ALLOYS; STRAIN ENERGY; STRAIN RATE; TIN ALLOYS; WELDING;

TIN;

EID: 59849087279     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0633-y     Document Type: Article

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