Effect of crystallography anisotropy of β-tin grains on thermal fatigue properties of Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solder interconnects

Science and Technology of Welding and Joining

Volumn 13, Issue 8, 2008, Pages 732-738

  Terashima, S ^a   Kobayashi, T ^a   Tanaka, M ^a  

^a NIPPON STEEL CORPORATION   (Japan)

Author keywords

Crystallography anisotropy; Grain boundary character distribution; Lead free solder; Orientation imaging microscopy; Sn Ag Cu; Thermal fatigue

Indexed keywords

ANISOTROPY; BRAZING; COPPER; CRYSTAL GROWTH; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; GRAIN (AGRICULTURAL PRODUCT); GRAIN BOUNDARIES; LEAD; MICROSTRUCTURE; MINERALOGY; POWDERS; RECRYSTALLIZATION (METALLURGY); SILVER; SINGLE CRYSTALS; SOLDERING ALLOYS; THERMAL FATIGUE; TITANIUM COMPOUNDS; WELDING;

CRYSTALLOGRAPHY ANISOTROPY; GRAIN BOUNDARY CHARACTER DISTRIBUTION; LEAD FREE SOLDER; ORIENTATION IMAGING MICROSCOPY; SN-AG-CU;

TIN;

EID: 56749132923     PISSN: 13621718     EISSN: 13621718     Source Type: Journal    
DOI: 10.1179/136217108X336270     Document Type: Article

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