SCOPUS 정보 검색 플랫폼

Volumn 507, Issue 1, 2010, Pages 215-224

The study of mechanical properties of Sn-Ag-Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

(5) Che, F X a,b Zhu, W H b Poh, Edith S W b Zhang, X W a Zhang, X R b

a INSTITUTE OF MICROELECTRONICS (Singapore)

b United Test and Assembly Center Ltd UTAC (Singapore)

Author keywords

Lead free solders; Mechanical property; Microstructure; Sn Ag Cu; Strain rate

Indexed keywords

CONDUCTING TESTS; CONTENT DEPENDENT; EFFECT OF STRAIN; EFFECT OF TEMPERATURE; HIGH STRENGTH; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; MICROSTRUCTURES AND MECHANICAL PROPERTIES; NI-DOPING; SN DENDRITES; SN-3.0AG-0.5CU; SN-AG-CU; SN-AG-CU LEAD-FREE SOLDERS; SNAGCU SOLDER; STAIN RATES; TENSILE TESTS; TEST RESULTS; ULTIMATE TENSILE STRENGTH;

DENDRITES (METALLOGRAPHY); ELASTIC MODULI; INTERMETALLICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; NEURONS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN RATE; TENSILE STRENGTH; TENSILE TESTING; TIN ALLOYS; YIELD STRESS;

TIN;

EID: 77956619074 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2010.07.160 Document Type: Article

Times cited : (142)

References (33)

1
- 0036603885
- M. Amagai, M. Watanabe, M. Omiya, K. Kishimoto, and T. Shibuya Microelectron. Reliab. 42 2002 951 966
- (2002) Microelectron. Reliab. , vol.42 , pp. 951-966
- Amagai, M.¹ Watanabe, M.² Omiya, M.³ Kishimoto, K.⁴ Shibuya, T.⁵

2
- 0942299489
- S. Terashima, Y. Kariya, T. Hosoi, and M. Tanaka J. Electron. Mater. 32 2003 1527 1533
- (2003) J. Electron. Mater. , vol.32 , pp. 1527-1533
- Terashima, S.¹ Kariya, Y.² Hosoi, T.³ Tanaka, M.⁴

3
- 0038012862
- M. Amagai, Y. Toyoda, and T. Tajima Proceedings of Electronic Components and Technology Conference 2003 317 322
- (2003) Proceedings of Electronic Components and Technology Conference , pp. 317-322
- Amagai, M.¹ Toyoda, Y.² Tajima, T.³

4
- 0037302714
- K.S. Kim, S.H. Huh, and K. Suganuma Microelectron. Reliab. 43 2003 259 267
- (2003) Microelectron. Reliab. , vol.43 , pp. 259-267
- Kim, K.S.¹ Huh, S.H.² Suganuma, K.³

5
- 33845586688
- M. Amagai Proceedings of Electronic Components and Technology Conference 2006 1170 1190
- (2006) Proceedings of Electronic Components and Technology Conference , pp. 1170-1190
- Amagai, M.¹

6
- 33845694955
- I.E. Anderson J. Mater. Sci.: Mater. Electron. 18 2007 55 76
- (2007) J. Mater. Sci.: Mater. Electron. , vol.18 , pp. 55-76
- Anderson, I.E.¹

7
- 61349173093
- T. Laurila, J. Hurtig, V. Vuorinen, and J.K. Kivilahti Microelectron. Reliab. 49 2009 242 247
- (2009) Microelectron. Reliab. , vol.49 , pp. 242-247
- Laurila, T.¹ Hurtig, J.² Vuorinen, V.³ Kivilahti, J.K.⁴

8
- 70350126964
- P. Liu, P. Yao, and J. Liu J. Alloys Compd. 486 2009 474 479
- (2009) J. Alloys Compd. , vol.486 , pp. 474-479
- Liu, P.¹ Yao, P.² Liu, J.³

9
- 67349083563
- Y.W. Wang, Y.W. Lin, C.T. Tu, and C.R. Kao J. Alloys Compd. 478 2009 121 127
- (2009) J. Alloys Compd. , vol.478 , pp. 121-127
- Wang, Y.W.¹ Lin, Y.W.² Tu, C.T.³ Kao, C.R.⁴

10
- 67349152353
- Y.W. Wang, C.C. Chang, and C.R. Kao J. Alloys Compd. 478 2009 L1 L4
- (2009) J. Alloys Compd. , vol.478
- Wang, Y.W.¹ Chang, C.C.² Kao, C.R.³

11
- 42449093723
- L.H. Xu, J.H.L. Pang, and F.X. Che J. Electron. Mater. 37 2008 880 886
- (2008) J. Electron. Mater. , vol.37 , pp. 880-886
- Xu, L.H.¹ Pang, J.H.L.² Che, F.X.³

12
- 51349145336
- W.H. Zhu, L.H. Xu, J.H.L. Pang, X.R. Zhang, E. Poh, Y.F. Sun, A.Y.S. Sun, C.K. Wang, and H.B. Tan Proceedings of Electronic Components and Technology Conference 2008 1667 1672
- (2008) Proceedings of Electronic Components and Technology Conference , pp. 1667-1672
- Zhu, W.H.¹ Xu, L.H.² Pang, J.H.L.³ Zhang, X.R.⁴ Poh, E.⁵ Sun, Y.F.⁶ Sun, A.Y.S.⁷ Wang, C.K.⁸ Tan, H.B.⁹

13
- 33645566980
- S.K. Kang, D. Leonard, D.Y. Shih, L. Gignac, D.W. Henderson, S. Cho, and J. Yu J. Electron. Mater. 35 2006 479 485
- (2006) J. Electron. Mater. , vol.35 , pp. 479-485
- Kang, S.K.¹ Leonard, D.² Shih, D.Y.³ Gignac, L.⁴ Henderson, D.W.⁵ Cho, S.⁶ Yu, J.⁷

14
- 33845716824
- C.M.L. Wu, and Y.W. Wong J. Mater. Sci.: Mater. Electron. 18 2007 77 91
- (2007) J. Mater. Sci.: Mater. Electron. , vol.18 , pp. 77-91
- Wu, C.M.L.¹ Wong, Y.W.²

15
- 32644433186
- C.M.T. Law, C.M.L. Wu, D.Q. Yu, L. Wang, and J.K.L. Lai J. Electron. Mater. 35 2006 89 93
- (2006) J. Electron. Mater. , vol.35 , pp. 89-93
- Law, C.M.T.¹ Wu, C.M.L.² Yu, D.Q.³ Wang, L.⁴ Lai, J.K.L.⁵

16
- 17144387501
- B. Li, Y. Shi, Y. Lei, F. Guo, Z. Xia, and B. Zong J. Electron. Mater. 34 2005 217 224
- (2005) J. Electron. Mater. , vol.34 , pp. 217-224
- Li, B.¹ Shi, Y.² Lei, Y.³ Guo, F.⁴ Xia, Z.⁵ Zong, B.⁶

17
- 56849085502
- J.X. Wang, S.B. Xue, Z.J. Han, S.L. Yu, Y. Chen, Y.P. Shi, and H. Wang J. Alloys Compd. 467 2009 219 226
- (2009) J. Alloys Compd. , vol.467 , pp. 219-226
- Wang, J.X.¹ Xue, S.B.² Han, Z.J.³ Yu, S.L.⁴ Chen, Y.⁵ Shi, Y.P.⁶ Wang, H.⁷

18
- 61449208110
- W. Xiao, Y. Shi, G. Xu, R. Ren, F. Guo, Z. Xia, and Y. Lei J. Alloys Compd. 472 2009 198 202
- (2009) J. Alloys Compd. , vol.472 , pp. 198-202
- Xiao, W.¹ Shi, Y.² Xu, G.³ Ren, R.⁴ Guo, F.⁵ Xia, Z.⁶ Lei, Y.⁷

19
- 40349114531
- Y. Shi, J. Tian, H. Hao, Z. Xia, Y. Lei, and F. Guo J. Alloys Compd. 453 2008 180 184
- (2008) J. Alloys Compd. , vol.453 , pp. 180-184
- Shi, Y.¹ Tian, J.² Hao, H.³ Xia, Z.⁴ Lei, Y.⁵ Guo, F.⁶

20
- 77953138466
- B.I. Noh, J.H. Choi, J.W. Yoon, and S.B. Jung J. Alloys Compd. 499 2010 154 159
- (2010) J. Alloys Compd. , vol.499 , pp. 154-159
- Noh, B.I.¹ Choi, J.H.² Yoon, J.W.³ Jung, S.B.⁴

21
- 85047234243
- T.H. Chung, and S.F. Yen J. Eletron. Mater. 35 2006 1621 1627
- (2006) J. Eletron. Mater. , vol.35 , pp. 1621-1627
- Chung, T.H.¹ Yen, S.F.²

22
- 77954216350
- H.J. Lin, and T.H. Chuanga J. Alloys Compd. 500 2010 167 174
- (2010) J. Alloys Compd. , vol.500 , pp. 167-174
- Lin, H.J.¹ Chuanga, T.H.²

23
- 0037463944
- K.S. Kim, S.H. Huh, and K. Suganuma J. Alloys Compd. 352 2003 226 236
- (2003) J. Alloys Compd. , vol.352 , pp. 226-236
- Kim, K.S.¹ Huh, S.H.² Suganuma, K.³

24
- 33645569588
- D. Li, C. Liu, and P.P. Conway J. Electron. Mater. 35 2006 388 398
- (2006) J. Electron. Mater. , vol.35 , pp. 388-398
- Li, D.¹ Liu, C.² Conway, P.P.³

25
- 42949112013
- D.Q. Yu, and L. Wang J. Alloys Compd. 458 2008 542 547
- (2008) J. Alloys Compd. , vol.458 , pp. 542-547
- Yu, D.Q.¹ Wang, L.²

26
- 2342640135
- Y. Kariya, T. Hosoi, S. Terashima, M. Tanaka, and M. Otsuka J. Electron. Mater. 33 2004 321 328
- (2004) J. Electron. Mater. , vol.33 , pp. 321-328
- Kariya, Y.¹ Hosoi, T.² Terashima, S.³ Tanaka, M.⁴ Otsuka, M.⁵

27
- 74149090636
- S.Y. Chang, Y.C. Huang, and Y.M. Lin J. Alloys Compd. 490 2010 508 514
- (2010) J. Alloys Compd. , vol.490 , pp. 508-514
- Chang, S.Y.¹ Huang, Y.C.² Lin, Y.M.³

28
- 0037674774
- J.H.L. Pang, B.S. Xiong, C.C. Neo, X.R. Zhang, and T.H. Low Proceedings of Electronic Components and Technology Conference 2003 673 679
- (2003) Proceedings of Electronic Components and Technology Conference , pp. 673-679
- Pang, J.H.L.¹ Xiong, B.S.² Neo, C.C.³ Zhang, X.R.⁴ Low, T.H.⁵

29
- 0346216053
- I. Shohji, T. Yoshida, T. Takahashi, and S. Hioki Mater. Sci. Eng. A 366 2004 50 55
- (2004) Mater. Sci. Eng. A , vol.366 , pp. 50-55
- Shohji, I.¹ Yoshida, T.² Takahashi, T.³ Hioki, S.⁴

30
- 34247638561
- F. Zhu, H. Zhang, R. Guan, and S. Liu J. Alloys Compd. 438 2007 100 105
- (2007) J. Alloys Compd. , vol.438 , pp. 100-105
- Zhu, F.¹ Zhang, H.² Guan, R.³ Liu, S.⁴

31
- 0036353445
- Y. Xiang, X. Chen, and J.J. Vlassak Proc. Mater. Res. Soc. Symp. 695 2002 L4.9.1-L4.9.6
- (2002) Proc. Mater. Res. Soc. Symp. , vol.695
- Xiang, Y.¹ Chen, X.² Vlassak, J.J.³

32
- 3142665555
- H.D. Merchant, G. Khatibi, and B. Weiss J. Mater. Sci. 39 2004 4157 4170
- (2004) J. Mater. Sci. , vol.39 , pp. 4157-4170
- Merchant, H.D.¹ Khatibi, G.² Weiss, B.³

33
- 37249000886
- T. Ventura, C.M. Gourlay, K. Nogita, T. Nishimura, M. Rappaz, and A. Dahle J. Electron. Mater. 37 2008 32 39
- (2008) J. Electron. Mater. , vol.37 , pp. 32-39
- Ventura, T.¹ Gourlay, C.M.² Nogita, K.³ Nishimura, T.⁴ Rappaz, M.⁵ Dahle, A.⁶

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