Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 404-411

  Syed, Ahmer ^a   Tae, Seong Kim ^b   Young, Min Cho ^b   Chang, Woo Kim ^b   Min, Yoo ^b  

^a AMKOR TECHNOLOGY   (United States)

^b Amkor Technology Korea Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CHIP SCALE PACKAGES; COPPER; COPPER ALLOYS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; LEAD; NICKEL; TECHNOLOGY; WELDING;

ALLOYING EFFECTS; CHIP-SCALE PACKAGING; PACKAGING TECHNOLOGIES; PB-FREE SOLDERS; SN-PB SOLDER; TEMPERATURE CYCLE TEST;

SOLDERING ALLOYS;

EID: 35348912923     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342750     Document Type: Conference Paper

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