SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 31, Issue 11, 2002, Pages 1190-1194

Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-free solder alloys

(4) Cook, B A a Anderson, I E a Harringa, J L a Terpstra, R L a

a IOWA STATE UNIVERSITY (United States)

Author keywords

Electrical resistivity; Heat treatment; Microstructure; Pb free solder

Indexed keywords

COMPOSITION; COPPER; ELECTRIC CONDUCTIVITY; HEAT TREATMENT; METALLOGRAPHIC MICROSTRUCTURE; SOLDERED JOINTS; SOLDERING; SUBSTRATES; THERMAL EFFECTS; TIN ALLOYS;

EUTECTIC TIN-SILVER-COPPER ALLOY; LEAD-FREE SOLDER ALLOY; METALLOGRAPHIC INSPECTION;

SOLDERING ALLOYS;

EID: 0036865875 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-002-0009-7 Document Type: Article

Times cited : (40)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.