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Journal of Materials Research

Volumn 15, Issue 8, 2000, Pages 1679-1687

Interfacial morphology and shear deformation of flip chip solder joints

(6) Jang, J W a Liu, C Y a Kim, P G a Tu, K N a Mal, A K b Frear, D R c

a UNIVERSITY OF CALIFORNIA (United States)

b University of California (United States)

c MOTOROLA INC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; FLIP CHIP DEVICES; METALLIZING; SHEAR DEFORMATION; STRESS ANALYSIS; SUBSTRATES; THERMAL EXPANSION;

UNDER-BUMP METALLIZATION (UBM);

SOLDERED JOINTS;

EID: 0034256164 PISSN: 08842914 EISSN: None Source Type: Journal
DOI: 10.1557/JMR.2000.0242 Document Type: Article

Times cited : (29)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.