Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints

Journal of Electronic Materials

Volumn 31, Issue 10 SPEC., 2002, Pages 1122-1128

  Chen, Z G ^a   Shi, Y W ^a   Xia, Z D ^a   Yan, Y F ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Creep; Lead free solder; Microstructure; Rare earth; SnAgCu

Indexed keywords

CREEP; ENERGY DISPERSIVE SPECTROSCOPY; MICROSTRUCTURE; RARE EARTHS; SOLDERING ALLOYS; TIN ALLOYS; X RAY ANALYSIS;

SINGLE-LAP JOINTS;

SOLDERED JOINTS;

EID: 0036809677     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0052-4     Document Type: Conference Paper

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