Constitutive relations on creep for SnAgCuRE lead-free solder joints

Journal of Electronic Materials

Volumn 33, Issue 9, 2004, Pages 964-971

  Chen, Zhigang ^a   Shi, Yaowu ^a   Xia, Zhidong ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Constitutive relations; Creep; Lead free solder; Rare earth (RE); SnAgCu

Indexed keywords

ACTIVATION ENERGY; CREEP; CRYSTAL STRUCTURE; DEFORMATION; DIFFUSION; DISLOCATIONS (CRYSTALS); REACTION KINETICS; STRAIN; THICKNESS MEASUREMENT; TIN ALLOYS;

CONSTITUTIVE RELATIONS; LEAD-FREE SOLDER; SNAGCU; STRAIN TESTS;

SOLDERED JOINTS;

EID: 4944260315     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0023-z     Document Type: Article

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