Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 174-178

  Zhao, X J ^a   Caers, J F J M ^b   De Vries, J W C ^b   Kloosterman, J ^c   Wong, E H ^d   Rajoo, R ^d  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

^d INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; BRAZING; CHIP SCALE PACKAGES; COPPER; DROPS; ELECTRIC CURRENTS; ELECTRONICS PACKAGING; EUTECTICS; FLUID MECHANICS; IMPACT RESISTANCE; LEAD; LEAD ALLOYS; METALLIC COMPOUNDS; NICKEL COMPOUNDS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; SPEED; SUBSTRATES; TECHNOLOGY; TESTING; WELDING;

BGA PACKAGES; BRITTLE FAILURES; COPPER CONTENTS; DROP TESTING; ELECTRONIC PACKAGING; HIGH SPEEDS; LEAD-FREE BGA; LEAD-FREE SOLDER; MECHANICAL IMPACTS; PACKAGING TECHNOLOGIES; PB-FREE SOLDER ALLOYS; PB-FREE SOLDER BUMPS; PB-FREE SOLDERS; PORTABLE ELECTRONICS; SHEAR TESTING; SN-PB SOLDER; SOLDER INTERCONNECTS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50249126081     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342711     Document Type: Conference Paper

References (16)

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16. th EPTC, Singapore, December 2005