A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

Microelectronics Reliability

Volumn 52, Issue 1, 2012, Pages 90-99

  Shnawah, Dhafer Abdulameer ^a   Sabri, Mohd Faizul Mohd ^a   Badruddin, Irfan Anjum ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; DROPS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; LEAD ALLOYS; RELIABILITY; SILVER ALLOYS; SOLDERED JOINTS; THERMAL CYCLING; TIN ALLOYS;

BULK ALLOY MICROSTRUCTURES; LEAD-FREE SOLDER ALLOY; LIGHT WEIGHT; MULTIFUNCTIONALITY; PORTABLE ELECTRONICS; RELIABILITY REQUIREMENTS; SOLDER JOINT RELIABILITY; THERMAL CYCLING RELIABILITY;

LEAD-FREE SOLDERS;

EID: 84155160718     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.07.093     Document Type: Review

References (77)

1. Syed A, Scanlan J, Cha S, Kang W, Sohn E, Kim T, et al. Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions. In: Proc 58th IEEE-ECTC conf; 2008. p. 1453-61.
2. Frear DR, Ramanathan LN, Jang J-W, Owens NL. Emerging reliability challenges in electronic packaging. In: Proc 46th IEEE - annual international reliability physics symposium; 2008. p. 450-4.
3. B. Zhang, H. Ding, and X. Sheng Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact Microelectron Reliab 49 2009 530 536
4. Chong DYR, Ng K, Tan JYN, Low PTH, Pang JHL, Che FX, et al. Drop impact reliability testing for lead-free and leaded soldered IC packages. In: Proc 55th IEEE-ECTC conf; 2005. p. 622-9. (Pubitemid 41276239)
5. M. Amagai, M. Watanabe, M. Omiya, K. Kishimoto, and T. Shibuya Mechanical characterization of Sn-Ag based lead-free solders Microelectron Reliab 42 2002 951 966 (Pubitemid 34551888)
6. S. Terashima, Y. Kariya, T. Hosoi, and M. Tanaka Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects J Electron Mater 32 2003 1527 1533
7. Amagai M, Toyoda Y, Tajima T. High solder joint reliability with lead free solders. In: Proc 53rd IEEE-ECTC conf; 2003. p. 317-22.
8. K.S. Kim, S.H. Huh, and K. Suganuma Effect of fourth additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu Microelectron Reliab 43 2003 259 267
9. Amagai M. A study of nano particles in SnAg-based lead free solders for intermetallic compounds and drop test performance. In: Proc 56rd IEEE-ECTC conf; 2006. p. 1170-90. (Pubitemid 44929826)
10. Pang JHL, Xiong BS, Neo CC, Bang XR, Low TH. Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy. In: Proc 53rd IEEE-ECTC conf; 2003. p. 673-9.
11. Yu AM, Jang JW, Kim JK, Lee JH, Kim MS. Improved reliability of Sn-Ag-Cu-In solder alloy by the addition of minor elements. In: Proc 60th IEEE-ECTC; 2010. p. 1524-8.
12. Kittidacha W, Kanjanavikat A, Vattananiyom K. Effect of SAC alloy composition on drop and temp cycle reliability of BGA with NiAu pad finish. In: Proc 10th IEEE-EPTC conf; 2008. p. 1074-9.
13. C.M. Miller, I.E. Anderson, and J.F. Smith A viable tin-lead solder substitute: Sn-Ag-Cu J Electron Mater 23 1994 595 601
14. D.R. Frear The mechanical behavior of interconnects materials for electronic packaging JOM 48 1996 49 53 (Pubitemid 126551131)
15. H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M. Fine Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders J Electron Mater 26 1997 783 790 (Pubitemid 127568994)
16. Vasudevan V, Fan X, Lui T, Young D. Slow cycle fatigue creep performance of Pb-free (LF) solders. In: Proc 57th IEEE-EPTC conf; 2007. p. 116-23. (Pubitemid 47577018)
17. B.irzer C, Rakow B, Steiner R, Walter J. Drop test reliability improvement of lead-free fine pitch BGA using different solder ball composition. In: Proc 7th IEEE-EPTC conf; 2005. p. 255-61.
18. Zhao XJ, Caers JFJM, Vries JWCD, Kloostermanc J, Wong EH, Rajoo R. Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps. In: Proc 8th IEEE-EPTC conf; 2007. p. 74-178.
19. S. Terashima, T. Kohno, A. Mizusawa, K. Arai, O. Okada, and T. Wakabayashi Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character J Electron Mater 38 2009 33 38
20. Soldertec European lead-free technology roadmap, ver 1; 2002. p. 1-26. < http://www.lead-free.org >.
21. K. Nimmo Alloy selection 2004 Marcel Dekker New York
22. http://www.metallurgy.nist.gov/phase/solder/solder.html.
23. H. Ma, and J.C. Suhling A review of mechanical properties of lead-free solders for electronic packaging J Mater Sci 44 2009 1141 1158
24. W.F. Hosford Physical metallurgy 2005 CRC Press, Taylor and Francis Group Boca Raton, FL USA
25. R. F Smallman, and R.J. Bishop Modern physical metallurgy and materials engineering 6th ed. 1999 Butterworth-Heinemann Oxford
26. D.K. Allen Metallurgy theory and practice 1969 American Technical Publishers Homewood, IL USA
27. Y. Kariya, T. Hossi, S. Terashima, M. Tanaka, and M. Otsuka Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnect J Electron Mater 33 2004 321 328
28. Tsai I, Tai L, Yen SF, Chuang TH, Lo R, Ku T, et al. Identification of mechanical properties of intermetallic compounds on lead-fee solder. In: Proc 55th IEEE-ECTC conf; 2005. p. 687-91. (Pubitemid 41276248)
29. Fields RJ, Low SR. Physical and mechanical properties of intermetallic compounds commonly found in solder joints. < http://www.metallurgy.nist.gov/ mechanical-properties/solder-paper.html >.
30. D. Suh, D.W. Kim, P. Liu, H. Kim, J.A. Weninger, and C.M. Kumar Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high strain rate conditions Mater Sci Eng A 46-461 2007 595 603 (Pubitemid 46593846)
31. Kim D, Suh D, Millard T, Kim H, Kumar C, Zhu M, et al. Evaluation of high compliant low Ag solder alloys on OSP as a drop solution for the 2 level Pb-free interconnection. In: Proc 57th IEEE-ECTC conf; 2007. p. 1614-9. (Pubitemid 47577243)
32. S. Ganesan, and M. Pecht Lead-free electronics 2006 Wiley-Interscience Publication New York
33. F.X. Che, W.H. Zhu, E.S.W. Poh, X.W. Zhang, and X.R. Zhang The study of mechanical properties of Sn-Ag-Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures J Alloy 507 2010 215 224
34. Che FX, Luan JE, Baraton X. Effect of Silver Content and Nickel Dopant on Mechanical Properties of Sn-Ag-based Solders. In: Proc 58th IEEE-ECTC conf; 2008. p. 485-90.
35. Kim D, et al. Evaluation of high compliant low Ag solder alloys on OSP as a drop solution for the 2nd level Pb-free interconnection. In: Proc 57th IEEE-ECTC conf; 2007. p. 1614-9. (Pubitemid 47577243)
36. Henshall G, Healey R, Pandher RS, Sweatman K, Howell K, Coyle R, et al. Addressing opportunities and risks of Pb-free solder alloy alternatives. In: Proc IEEE-EMPC; 2009. p. 1-11.
37. Syed A, Kim TS, Cho YM, Kim CW, Yoo M. Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish. In: Proc 8th IEEE-EPTC conf; 2006. p. 404-11.
38. M.P. Renavikar, N. Patel, A. Dani, V. Wakharkar, G. Arrigotti, and V. Vasudevan Materials technology for environmentally green micro-electronic packaging Intel® Technol J 12 2008 1 16
39. Kim H, Zhang M, Kumar CM, Suh D, Liu P, Kim D, et al. Improved drop reliability performance with lead free solders of low Ag content and their failure modes. In: Proc IEEE-ECTC conf; 2007. p. 717-824.
40. Pang JHL, Che FX. Drop impact analysis of Sn-Ag-Cu solder joints using dynamic high-strain rate plastic strain as the impact damage driving force. In: Proc 56th IEEE-ECTC conf; 2006. p. 49-54. (Pubitemid 44929655)
41. R.O. Ritchie Mechanisms of fatigue crack propagation in metals, ceramics and composites: role of crack tip shielding Mater Sci Eng A 103 1988 15 28
42. Pandher RS, Lewis BG, Vangaveti R, Singh B. Drop shock reliability of lead-free alloys - effect of micro-additives. In: Proc 57th IEEE-ECTC; 2007. p. 669-76. (Pubitemid 47577101)
43. Che FX, Poh EC, Zhu WH, Xiong BS. Ag content effect on mechanical properties of Sn-xAg-0.5Cu solders. In: Proc 9th IEEE-EPTC conf; 2007. p. 713-8.
44. L. Garner, S. Sane, D. Suh, T. Byrne, A. Dane, and T. Martin Finding solutions to the challenges in package interconnect reliability Intel Technol J 9 2009 297 308
45. S. Park, R. Dhakal, L. Lehman, and E. Cotts Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading Acta Mater 55 2007 3253 3260 (Pubitemid 46603069)
46. M.A. Matin, W.P. Vellinga, and M.G.D. Geers Thermomechanical fatigue damage evolution in SAC solder joints Mater Sci Eng A 445-446 2007 73 85 (Pubitemid 46024487)
47. Mattila TT, Mueller M, Paulasto-Krockel M, Wolter K-J. Failure mechanism of solder interconnections under thermal cycling conditions. In: Proceedings of the 3rd IEEE-ESTC; 2010. p. 1-8.
48. Mattila T. PhD thesis. Reliability of high-density lead-free solder interconnections under thermal cycling and mechanical shock loading. Finland: Helsinki University of Technology; 2005.
49. P. Lauro, S.K. Kang, W.K. Choi, and D.Y. Shih Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders J Electron Mater 32 2003 1432 1440
50. S. Terashima, K. Takahama, M. Nozaki, and M. Tanaka Recrystallization of Sn grains due to thermal strain in Sn-1.2Ag-0.5Cu-0.05Ni solder Mater Trans 45 2004 1383 1390
51. T.T. Mattila, V. Vuorinen, and J.K. Kivilahti Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections J Mater Res 19 2004 3214 3223 (Pubitemid 40055653)
52. A.U. Telang, T.R. Bieler, A. Zamiri, and F. Pourboghrat Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint Acta Mater 55 2007 2265 2277 (Pubitemid 46436566)
53. D.R. Frear Issues related to the implementation of Pb-free electronic solders in consumer electronics J Mater Sci Mater Electron 18 2007 319 330 (Pubitemid 44963694)
54. S. Terashima, T. Kobayashi, and M. Tanaka Effect of crystallographic anisotropy of b-tin grains on thermal fatigue properties of Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solder interconnects Sci Technol Weld Join 13 2008 732 738
55. S. Terashima, and M. Tanaka Effect of fine dispersoids and anisotropic nature of β-Sn on thermal fatigue properties of flip chips connected by Sn-xAg-0.5Cu (x: 1, 3 and 4 mass%) lead free solders Sci Technol Weld Join 14 2009 768 775
56. S.-K. Seo, S.K. Kang, M.G. Cho, D.-Y. Shih, and H.M. Lee The crystal orientation of β-Sn Grains in Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) under bump metallurgy J Electron Mater 38 2009 2461 2469
57. T.K. Lee, B. Zhou, L. Blair, K.-C. Liu, and T.R. Bieler Sn-Ag-Cu solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy J Electron Mater 39 2010 2588 2597
58. K.N. Subramanian, and J.G. Lee Effect of anisotropy of tin on thermomechanical behavior of solder joints J Mater Sci Mater Electron 5 2004 235 240
59. M.A. Matin, E.W.C. Coenen, W.P. Vellinga, and M.G.D. Geers Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy Scripta Mater 53 2005 927 932 (Pubitemid 41084866)
60. T.R. Bieler, H. Jiang, L.P. Lehman, T. Kirkpatrick, E.J. Cotts, and B. Nandagopal Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints IEEE-CPMT 31 2008 370 381
61. S.B. Park, R. Dhakal, L.P. Lehman, and E.J. Cotts Grain deformation and strain in board-level SnAgcu solder interconnects under deep thermal cycling IEEE-CPMT 30 2007 178 185 (Pubitemid 46563143)
62. M.A. Matin, E.W.C. Cohen, W.P. Vellinga, and M.G.D. Geers Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy Scripta Mater 53 2005 927 932 (Pubitemid 41084866)
63. Park SB, Dhakal R, Lehman LP, Cotts EJ. Grain formation and intergrain stresses in a Sn-Ag-Cu solder ball. In: Proceedings of ASME InterPACK; 2005. p. 1095-100. (Pubitemid 43251607)
64. S. Terashima, Y. Kariya, and M. Tanaka Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by Nickel addition Mater Trans 45 2004 673 680
65. S. Terashima, and M. Tanaka Thermal fatigue properties of Sn-1.2Ag-0.5Cu-xNi flip-chip interconnects Mater Trans 45 2004 681 688
66. K.N. Subramanian, and J.G. Lee Physical metallurgy in lead-Free electronic solder development JOM 55 2003 26 32
67. L. Ye, Z.H. Lai, J. Liu, and A. Tholen Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead free solders Solder Surf Mt Technol 13 2001 16 20 (Pubitemid 33039054)
68. G.E. Dieter Mechanical metallurgy 2nd ed. 1981 McGraw-Hill Tokyo
69. Liu W, Lee NC, Porras A, Ding M, Gallagher A, Huang, et al. Achieving high reliability low cost lead-free SAC solder joints via Mn or Ce doping. In: Proceedings of the 59th IEEE-ECTC conf; 2009. p. 994-1007.
70. Kobayashi T, Kariya Y, Sasaki T, Tanakal M, Tatsumi K. Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. In: Proceedings of the 57th IEEE-ECTC conf; 2007. p. 684-8. (Pubitemid 47577103)
71. Y. Kariya, T. Hosoi, T. Kimura, S. Terashima, and M. Tanaka Low cycle fatigue properties of ni added low silver content Sn-Ag-Cu flip chip interconnects Mater Trans 45 2004 689 694
72. K. Honda Configurations, formation and burgers vector of coupled dislocations straddling a polygon wall in white tin single crystals Jpn J Appl Phys 17 1978 33 41 (Pubitemid 8581840)
73. T. Watanabe Grain boundary design and control for high temperature materials Mater Sci Eng A 166 1993 11 28 (Pubitemid 23689822)
74. J.K. Shang, Q.L. Zeng, L. Zhang, and Q.S. Zhu Mechanical fatigue of Sn-rich Pb-free solder alloys J Mater Sci Mater Electron 18 2007 211 227 (Pubitemid 44963686)
75. T. Watanabe Structure-dependent grain boundary deformation and fracture at high temperatures Mater Sci Eng A 410 A411 2005 140 147 (Pubitemid 41762284)
76. M.A. Matin, E.W.C. Coenen, W.P. Vellinga, and M.G.D. Geers Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy Scripta Mater 52 2005 927 932 (Pubitemid 41084866)
77. S. Terashima, M. Tanaka, and K. Tatsumi Thermal fatigue properties and grain boundary character distribution in Sn-xAg-0.5Cu (x = 1, 1.2 and 3) lead free solder interconnects Sci Technol Weld Join 13 2008 60 65 (Pubitemid 351655360)