Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1667-1672

  Zhu, W H ^a   Xu, Luhua ^b   Pang, John H L ^b   Zhang, X R ^a   Poh, Edith ^a   Sun, Y F ^b   Sun, Anthony Y S ^a   Wang, C K ^a   Tan, H B ^a  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COMPUTER NETWORKS; CONCENTRATION (PROCESS); COPPER; DROPS; ELECTRIC CURRENTS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FLUID MECHANICS; MECHANICAL PROPERTIES; METALLIC COMPOUNDS; NICKEL; NICKEL ALLOYS; RELIABILITY; SILVER; SURFACES; WELDING;

SURFACE FINISHING;

LEAD;

EID: 51349145336     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550202     Document Type: Conference Paper

References (7)

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5. th ECTC, San Diego, USA.
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