Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy

Materials Science and Engineering: A

Volumn 527, Issue 6, 2010, Pages 1343-1350

  Song, H Y ^a   Zhu, Q S ^a   Wang, Z G ^a   Shang, J K ^a,b   Lu, M ^c  

^a INSTITUTE OF METAL RESEARCH   (China)

^b United States of America   (United States)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Intermetallic compound; Lead free solder; Sn Ag Cu alloy; Tensile property; Zn addition

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; FRACTURE; LEAD ALLOYS; LEAD-FREE SOLDERS; MICROSTRUCTURE; SILVER ALLOYS; SOLDERED JOINTS; SURFACE ANALYSIS; TENSILE STRENGTH; TENSILE TESTING; TIN ALLOYS; ZINC ALLOYS;

FRACTURE SURFACE ANALYSIS; INTERMETALLICS COMPOUNDS; STRENGTH AND ELONGATIONS; SURFACE OBSERVATION; TEM OBSERVATIONS; ZN ADDITION; ZN CONTENT;

TERNARY ALLOYS;

EID: 75149185040     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2009.10.048     Document Type: Article

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