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Volumn 18, Issue 1-3, 2007, Pages 319-330
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Issues related to the implementation of Pb-free electronic solders in consumer electronics
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Author keywords
[No Author keywords available]
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Indexed keywords
CONSUMER ELECTRONICS;
ELECTROMIGRATION;
ELECTRONICS PACKAGING;
FATIGUE OF MATERIALS;
HIGH TEMPERATURE EFFECTS;
RELIABILITY;
SURFACE REACTIONS;
HIGH TEMPERATURE REFLOW;
LEAD-FREE ALLOYS;
THERMOMECHANICAL FATIGUE;
SOLDERING ALLOYS;
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EID: 33845700856
PISSN: 09574522
EISSN: 1573482X
Source Type: Journal
DOI: 10.1007/s10854-006-9021-7 Document Type: Article |
Times cited : (50)
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References (25)
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