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Volumn 18, Issue 1-3, 2007, Pages 319-330

Issues related to the implementation of Pb-free electronic solders in consumer electronics

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; ELECTROMIGRATION; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; HIGH TEMPERATURE EFFECTS; RELIABILITY; SURFACE REACTIONS;

EID: 33845700856     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9021-7     Document Type: Article
Times cited : (50)

References (25)
  • 11
    • 33845692112 scopus 로고    scopus 로고
    • Sandia National Labs Report # SAND96-0037
    • D.R. Frear, Sandia National Labs Report # SAND96-0037 (1997)
    • (1997)
    • Frear, D.R.1
  • 14
    • 0004461185 scopus 로고
    • in ed. M.J. Cieslak, M.E. Glicksman, S. Kang, J.H. Perepezko (TMS Publications, Warrendale, PA)
    • D.R. Frear, in The Metal Science of Joining, ed. M.J. Cieslak, M.E. Glicksman, S. Kang, J.H. Perepezko (TMS Publications, Warrendale, PA, 1992) p. 191
    • (1992) The Metal Science of Joining , pp. 191
    • Frear, D.R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.