Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products

Microelectronics Reliability

Volumn 52, Issue 11, 2012, Pages 2701-2708

  Shnawah, Dhafer Abdul Ameer ^a   Said, Suhana Binti Mohd ^a   Sabri, Mohd Faizul Mohd ^a   Badruddin, Irfan Anjum ^a   Che, Fa Xing ^b  

^a UNIVERSITY OF MALAYA   (Malaysia)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BULK SOLDER; DROP IMPACT; ELASTIC COMPLIANCE; LEAD-FREE SOLDER ALLOY; MELTING BEHAVIOR; MOBILE PRODUCTS; PLASTIC ENERGY DISSIPATION; SN GRAINS; SNAGCU SOLDER; SOLDER ALLOYS; TOTAL ELONGATIONS;

ALLOYS; CERIUM ALLOYS; ENERGY DISSIPATION; IRON ALLOYS; MECHANICAL PROPERTIES; PLASTIC PRODUCTS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 84867650025     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.03.028     Document Type: Article

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