Thermal fatigue properties and grain boundary character distribution in Sn-xAg-o.5Cu (x=1, 1.2 and 3) lead free solder interconnects

Science and Technology of Welding and Joining

Volumn 13, Issue 1, 2008, Pages 60-65

  Terashima, S ^a   Tanaka, M ^a   Tatsumi, K ^a  

^a NIPPON STEEL CORPORATION   (Japan)

Author keywords

Grain boundary character distribution; Lead free solder; Orientation imaging microscopy; Sn Ag Cu; Thermal fatigue

Indexed keywords

GRAIN BOUNDARIES; OPTICAL INTERCONNECTS; OPTICAL MICROSCOPY; SURFACE MORPHOLOGY; THERMAL FATIGUE;

GRAIN BOUNDARY CHARACTER DISTRIBUTION; LEAD FREE SOLDERS; ORIENTATION IMAGING MICROSCOPY;

SOLDERING ALLOYS;

EID: 43249090649     PISSN: 13621718     EISSN: 13621718     Source Type: Journal    
DOI: 10.1179/174329308X271788     Document Type: Article

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