Interfacial reaction between Sn{single bond}1Ag{single bond}0.5Cu({single bond}Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction

Journal of Alloys and Compounds

Volumn 471, Issue 1-2, 2009, Pages 291-295

  Lin, K S ^a   Huang, H Y ^b   Chou, C P ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL FORMOSA UNIVERSITY   (Taiwan)

Author keywords

Ball shear test; Co addition; Interfacial reaction; Joint strength; Lead free solder

Indexed keywords

ADDITION REACTIONS; BRAZING; CHEMICAL COMPOUNDS; COBALT COMPOUNDS; ELECTROCHEMICAL ELECTRODES; GOLD ALLOYS; LEAD; NICKEL; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; SPHERES; SURFACE REACTIONS; TESTING; WELDING;

BALL SHEAR TEST; CO ADDITION; INTERFACIAL REACTION; JOINT STRENGTH; LEAD-FREE SOLDER;

TIN;

EID: 60849118139     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.03.112     Document Type: Article

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