The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging

Microelectronics Reliability

Volumn 48, Issue 4, 2008, Pages 611-621

  Wong, C K ^a   Pang, J H L ^b   Tew, J W ^a   Lok, B K ^a   Lu, H J ^a   Ng, F L ^a   Sun, Y F ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DISSOLUTION; GROWTH KINETICS; METALLIZING; SOLDERED JOINTS; SOLID STATE REACTIONS; SURFACE CHEMISTRY;

DISSOLUTION RATE; ISOTHERMAL AGING; REFLOW SOLDERING; SOLDER VOLUME; SOLDERING INTERFACIAL REACTION;

SOLDERING ALLOYS;

EID: 42649143812     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.05.002     Document Type: Article

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