Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 210-216

  Tee, Tong Yan ^a   Ng, Hun Shen ^a   Zhong, Zhaowei ^b  

^a STMICROELECTRONICS   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DROPS; ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; THERMAL CYCLING;

BOARD LEVEL DROP TESTS; DROP-TEST PERFORMANCE; EMBEDDED PASSIVES; FAILURE MECHANISM; INTEGRATED PASSIVES; LEAD-FREE SOLDER JOINT; SOLDER JOINT RELIABILITY; THERMAL CYCLING TEST;

LEAD-FREE SOLDERS;

EID: 84954039444     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271518     Document Type: Conference Paper

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