Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading

Acta Materialia

Volumn 55, Issue 9, 2007, Pages 3253-3260

  Park, Seungbae ^a   Dhakal, Ramji ^a   Lehman, Lawrence ^b   Cotts, Eric ^b  

^a State University of New York   (United States)

^b BINGHAMTON UNIVERSITY   (United States)

Author keywords

BGA; Grain boundary; Pb free; SnAgCu

Indexed keywords

ANISOTROPY; CRYSTAL ORIENTATION; GRAIN BOUNDARIES; THERMAL LOAD; TIN ALLOYS;

GRAIN ORIENTATIONS; SOLDER INTERCONNECTS; SUBMICRON ACCURACY; THERMOMECHANICAL RESPONSE;

SOLDERING ALLOYS;

EID: 34247137610     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2007.01.028     Document Type: Article

References (14)

1. Subramanian K.N., and Lee J.G. Effect of anisotropy of tin on thermomechanical behavior of solder joints. J Mater Sci: Mater Electron 15 (2004) 235-240
2. Park SB, Dhakal R, Lehman LP, Cotts EJ. Grain deformation and strain in board-level SnAgcu solder interconnects under deep thermal cycling. IEEE CPMT, in press.
3. Park SB, Dhakal R, Lehman LP, Cotts EJ. Grain formation and intergrain stresses in a Sn-Ag-Cu solder ball. In: Proceedings of ASME InterPACK, San Francisco, CA, 2005.
4. Matin M.A., Cohen E.W.C., Vellinga W.P., and Geers M.G.D. Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy. Scripta Mater 53 (2005) 927-932
5. Rayne J.A., and Chandrasekhar B.S. Elastic constants of β tin from 4.2 K to 300 K. Phys Rev 115 63 (1990) 1658-1663
6. Henderson D.W., et al. The microstructure of Sn in near eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue. J Mater Res 19 6 (2004) 1608-1612
7. Lehman L.P., Athavale S.N., Fullem T.Z., Giamis A.C., Kinyanjui R.K., Lowenstein M., et al. Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder. J Electron Mater 33 12 (2004) 1429-1439
8. 3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys. J Mater Res 17 11 (2002) 2775-2778
9. Telang A.U., Bieler T.R., Lucas J.P., Subramanian K.N., Lehman L.P., Xing Y., et al. Grain boundary character and grain growth in bulk tin and bulk lead-free solder alloys. J Electron Mater 33 12 (2004) 1412-1423
10. Kim K.S., Huh S.H., and Suganuma K. Effects of intermetallics compounds on properties of Sn-Ag-Cu lead free solder joints. J Alloys Compd 1 (2002)
11. Sutton M.A., McNeill S.R., Helm J.D., and Chao Y.J. Advances in two-dimensional and three-dimensional computer vision, photomechanics. Top Appl Phys 77 (2000) 323-372
12. Schmidt T., Tyson J., and Galanulis K. Full-field dynamic displacement and strain measurement using advanced 3D image correlation photogrammetry. Exp Techniques Part I: vol. 27 3 (2003) 47-50 2003;Part II: vol. 27(4):p. 44-7
13. Shi X., Pang H.L.J., Zhang X.R., Liu Q.J., and Ying M. In situ micro-digital image speckle correlation technique for characterization of materials' properties and verification of numerical models. IEEE Trans Compon Pack Technol 27 (2004) 659
14. Park SB, Dhakal R, Gao J. Finite Elements analysis of three-dimensionally formed multiple grained SAC interconnects. J Exp Mech, in preparation.