The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

JOM

Volumn 59, Issue 7, 2007, Pages 26-31

  Liu, Weiping ^a   Lee, Ning Cheng ^a  

^a INDIUM CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; BRAZING; CERIUM; CERIUM COMPOUNDS; CHIP SCALE PACKAGES; COMPUTER OPERATING PROCEDURES; DOPING (ADDITIVES); DROPS; ELECTRIC CURRENTS; ELECTRONICS INDUSTRY; FLUID MECHANICS; HEALTH; IMPACT RESISTANCE; LEAD; LITHOGRAPHY; MANGANESE; MANGANESE COMPOUNDS; METALLIC COMPOUNDS; MICROSTRUCTURE; TITANIUM ALLOYS; WELDING;

ARRAY PACKAGES; BALL GRID ARRAY (BGA); CHIP-SCALE-PACKAGE (CSP); DOPING ELEMENTS; DROP IMPACT; DROP TEST PERFORMANCE; ELECTRONIC PACKAGING; ELECTRONIC PRODUCTS; INTERFACIAL FAILURES; LEAD FREE; PORTABLE DEVICES; SAC ALLOYS; SHOCK LOADINGS; SNAGCU (SAC) ALLOY; SOLDER JOINTS;

SOLDERING ALLOYS;

EID: 47049114291     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-007-0085-5     Document Type: Article

References (12)

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3. D. Henderson, "On the Question of SAC Solder Alloy-Cu Pad Solder Joint Fragility" (Presentation at Universal Instruments Consortium on SAC Solder Joint Fragility, Binghamton, NY, September 2004).
4. T. Gregorich et al., "SnNi and SnNiCu Intermetallic Compounds Found When Using SnAgCu Solders" (Presentation at the IPC/Soldertec Global 2nd International Conference on Lead Free Electronics Amsterdam, Netherlands, 2004).
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