SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 33, Issue 10, 2004, Pages 1137-1143

Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment

(2) Liao, C N a Wei, C T a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Growth kinetics; Interfacial reaction; Intermetallic compound

Indexed keywords

ACTIVATION ENERGY; BIMETALS; ELECTRIC CONDUCTIVITY; ELECTRIC PROPERTIES; GROWTH KINETICS; HEAT TREATMENT; INTERFACES (MATERIALS); METALLIZING; SCANNING ELECTRON MICROSCOPY; SURFACE CHEMISTRY; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

FILM STACKS; INTERFACIAL REACTION; PLASMA SPUTTERING; RAMPING RATE;

INTERMETALLICS;

EID: 7044284834 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-004-0115-9 Document Type: Conference Paper

Times cited : (29)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.