Pd-doped Sn-Ag-Cu-In solder material for high drop/shock reliability

Materials Research Bulletin

Volumn 45, Issue 3, 2010, Pages 359-361

  Yu, A Mi ^a   Kim, Jun Ki ^b   Lee, Jong Hyun ^c   Kim, Mok Soon ^a  

^a Inha University   (South Korea)

^b Advanced Welding and Joining R   (South Korea)

^c Seoul National University of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

MINOR ALLOYING; PB FREE SOLDERS; SN-3.0AG-0.5CU; SN-AG-CU; SOLDER ALLOYS; SOLDER MATERIAL; YIELD STRENGTH;

ALLOYING ELEMENTS; ALLOYS; COPPER ALLOYS; LEAD; PALLADIUM; RELIABILITY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 76349103497     PISSN: 00255408     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.materresbull.2009.12.030     Document Type: Article

References (12)

1. Vianco P.T., and Frear D.R. J. Met. 45 (1993) 14
2. Napp D.P. SAMPEJ 32 (1996) 59
3. Kariya Y., and Otsuka M. J. Electron. Mater. 27 (1998) 1229
4. Moon K.W., Boettinger W.J., Kattner U.R., Biancaniello F.S., and Handwerker C.A. J. Electron. Mater. 29 (2000) 1122
5. Suganuma K. Curr. Opin. Solid State Mater. Sci. 5 (2001) 55
6. Kim K.S., Huh S.H., and Suganuma K. Mater. Sci. Eng. A 333 (2002) 106
7. Bradley E., Handwerker C., and Sohn J.E. Surf. Mount Technol. (SMT) 1 (2003) 24
8. Wu C.M.L., Yu D.Q., Law C.M.T., and Wang L. Mater. Sci. Eng. R 44 (2004) 1
9. Liu W., and Lee N.-C. JOM 59 (2007) 26
10. Yu A.M., Kim M.-S., and Lee J.-H. Proceedings of 9th EMAP (2007)
11. Terashima S., Kariya Y., Hosoi T., and Tanaka M. J. Electron. Mater. 32 (2003) 12
12. Amagai M., Toyata Y., and Tajima T. Electronic Components and Technology Conference 2003 Proceedings, 53rd (2003) 317