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Volumn 35, Issue 3, 2006, Pages 388-398

Microstructure and shear strength evolution of Sn-Ag-Cu solder bumps during aging at different temperatures

Author keywords

Aging; Intermetallic (IMC) growth; Kirkendall voids; Lead free; Shear tests; Solder joint

Indexed keywords

AGING; INTERMETALLIC (IMC) GROWTH; KIRKENDALL VOIDS; LEAD FREE; SHEAR TESTS; SOLDER BUMPS;

EID: 33645569588     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02690524     Document Type: Article
Times cited : (30)

References (26)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.