Microstructure and shear strength evolution of Sn-Ag-Cu solder bumps during aging at different temperatures

Journal of Electronic Materials

Volumn 35, Issue 3, 2006, Pages 388-398

  Li, Dezhi ^a   Liu, Changqing ^a   Conway, Paul P ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Aging; Intermetallic (IMC) growth; Kirkendall voids; Lead free; Shear tests; Solder joint

Indexed keywords

AGING; INTERMETALLIC (IMC) GROWTH; KIRKENDALL VOIDS; LEAD FREE; SHEAR TESTS; SOLDER BUMPS;

AGING OF MATERIALS; FLIP CHIP DEVICES; INTERMETALLICS; MICROSTRUCTURE; SEMICONDUCTING SILVER COMPOUNDS; SHEAR STRENGTH;

SOLDERED JOINTS;

EID: 33645569588     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02690524     Document Type: Article

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